PCBA (Printed Circuit Board Assembly) Manufacturing Engineer

Hayward Holdings. (NYSE "HAYW") is the largest manufacturer of residential swimming pool equipment globally, with a significant presence in the commercial pool market that is continuously growing. Headquartered in Charlotte, North Carolina, Hayward designs, manufactures, and markets a full line of residential and commercial pool and spa equipment, including pumps, filters, heating, cleaners, salt chlorinators, automation, lighting, safety, flow control, and energy solutions at our company-owned facilities in North Carolina, Tennessee, Arizona, Rhode Island, Spain, and China. We have distribution facilities in France, Canada, and Arizona. For over 80-years, Hayward has been enhancing pool ownership by manufacturing cutting-edge, advanced pool and spa equipment. Hayward listens to our customers' needs and ensures they are implemented during the design and manufacturing process.  The goal is to become the preferred brand of choice with every residential and commercial swimming pool and spa. This role is based out of N. Kingstown, RI. 

Position Overview: 

Provide guidance and support as Manufacturing-Engineering lead for SMT, PCB assembly and Conformal Coat on new and legacy Hayward electronic products. 

Major Tasks and Responsibilities: 

• Assist in the development of a professional ME team to support the business processes and objectives. 
• Support execution of the manufacturing plan and lead its technical implementation as appropriate. Provide recommendations to enhance effectiveness of productivity, quality, and safety. 
• Transition key issues such as quality, cycle time, cost reduction, continuous improvement into functional ME objectives. 
• Work closely with Operations, Continuous Improvement, and Quality teams in readiness preparation for daily production Gemba meetings. 
• Act as an advisor to subordinate staff members on complex technical issues. This role is a technical working engineer that will guide front-line process developments and process improvements. 
• Define and direct projects to identify and implement continuous yield and process improvements, leading to cost effective, high quality, high yield, and world class manufacturing capabilities. 
• Assist the lead ME team to analyze and isolate root causes of process issues and develop and implement permanent solutions. Implement new technology and equipment for process control and cost reduction. 
• Assist in overseeing and guiding the team to implement and manage real time SPC and utilize Six Sigma tools to help implement meaningful process controls. 

Experience: 

• Experience with printed circuit board assembly equipment, methods, and processes such as stencil selection and printing, SMT component placement insertion, reflow, wave and selective soldering, manual and automatic optical inspection, conformal coating, and curing. 
• Experience in developing production equipment, tooling and fixtures, including design, justification specification and qualification. 
• Experience with Statistical Process Control and Lean Manufacturing techniques 
• A working knowledge of inspection techniques and equipment 
• Demonstrated project management ability – must facilitate groups and negotiate effectively with key suppliers. Interface with external vendors to source high quality equipment and fixtures. 
• Must be able to work effectively as part of a team to identify opportunities, identify product & equipment weaknesses and to be able to solve problems through collaboration and consensus. 
• Familiarity with manufacturing documents: BOM’s, Routers, Manufacturing Instructions, work orders etc. Create and maintain production routers. 
• Ability to work with CAD software, such as AutoCAD, SolidWorks and generate engineering drawings. 
• PC Computer proficiency with MS Office, Auto Cad and Solid Works Design software. 
• Hands on experience and knowledge of high density SMT assembly processes. 
• Understanding and experience developing high yielding soldering processes. 
• Understanding and experience with Conformal Coat applications. 
• Experience leading, supervising, or managing technical resources. 
• Proven success working New Product Introduction (NPI) process working closely with design engineering on advanced technology products and assembly needs.  
• Solid experience monitoring and improving manufacturing processes using principles such as SPC, Six Sigma, Lean Manufacturing, Kaizen, etc. 
• Knowledgeable in Design for Manufacturability (DFM) and scale-up of product from NPI stage thru full volume production 
• Thorough knowledge of related SMT materials and manufacturing processes. 
• Familiarity with advanced packaging and processing strategies for system in a package device (SIP) incorporating high layer count laminate (PCB) and ceramic substrates, ferrites, flip chips, BGA’s, lead-free soldering, MSL, high current interconnects a plus. 
• Good hands-on engineering skills and troubleshooting experience working on and the repair of PCBA production equipment. 

• Excellent writing and organizational skills 

• Bachelor's degree in Mechanical, Industrial, Chemical, or Manufacturing Engineering. Master’s degree and/or MBA is a plus. 
• 5-8 years’ Manufacturing or Process Engineering experience with an electronics manufacturer required.   2 years’ experience in a lead, supervisor, or managerial role preferred. 

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